Ku soo dhawoow mareegahayaga!
PCBA ee wax soo saarka dareemayaasha
| Dekedda FOB | Shiinaha (Mainland) |
| Waqtiga Hogaaminta | 7-15 maalmood |
- shirka SMT
- 2 dhigay mashiinka SMT-xawaaraha sare
- 2 waxay dejiyaan daabacayaal toos ah oo leh toosin aamin ah
- 2 dhigay mashiinada tijaabada ICT
- Golaha THT
- 2 qaybood oo ah khadadka mishiinka alxanka hirarka
- 1 qaybood oo si toos ah u gelista ka kooban: IST-4000
- ISO 9001:2008
- Shahaadada UL
- IPC-610D/E, u hoggaansanaanta fasalka II
- ICT, AOI, tijaabada shaqaynta
- Xakamaynta kaydka ee nidaamka ERP
- 1) shirka SMT oo ay ku jiraan golaha BGA
- 2) Chips SMD la aqbalay: 01005, BGA, QFP, QFN, TSOP
- 3) Dhererka qaybaha: 0.2-25mm
- 4) Xidhmada ugu yar: 0201
- 5) Masaafada ugu yar ee u dhaxaysa BGA: 0.25-2.0mm
- 6) Cabbirka ugu yar ee BGA: 0.1-0.63mm
- 7) Meesha ugu yar ee QFP: 0.35mm
- 8) Cabbirka ugu yar: (X) 50 * (Y) 30mm
- 9) Cabbirka kulanka ugu badan: (X): 350 * (Y) 550mm
- 10) Saxnimada meelaynta: ± 0.01mm
- 11) Awood meelaynta: 0805, 0603, 0402, 0201
- 12) Tirinta biinka sare ee saxafada ku haboon waa la heli karaa
- 13) Awoodda SMT maalintii: 800,000 dhibcood
- 1) Masuuliyadda alaabada adag, qaadashada heerka IPC-A-160
- 2) Ingineerinta ka hor wax soo saarka ka hor
- 3) Xakamaynta habka wax soo saarka (5ms)
- 4) 100% E-tijaabo, 100% kormeer muuqaal ah, oo ay ku jiraan IQC, IPQC, FQC, OQC
- 5) 100% kormeerka AOI, oo ay ku jiraan raajada, mikroskoob 3D iyo ICT
- 6) Tijaabada korantada sare, tijaabada xakamaynta impedance
- 7)Microsection, awoodda alxanka, tijaabada kulaylka stress, imtixaan naxdin leh
- 8) Wax soo saarka PCB ee guriga dhexdiisa
- 9) Ma jiro dalabka ugu yar ee tirada iyo muunad bilaash ah
- 10) Diirada saar wax soo saarka mugga hoose iyo midka dhexe
- 11) Si degdeg ah iyo waqti-geyneed
- - Aasiya
- - Australiya
- - Bartamaha/Koonfurta Ameerika
- - Yurubta bari
- - Bariga Dhexe/Afrika
- - Waqooyiga Ameerika
- - Yurubta galbeed
Halkan ku qor fariintaada oo noo soo dir
